Browse Prior Art Database

Inserting and Removing of Multipin Elements from a Printed Circuit Board

IP.com Disclosure Number: IPCOM000074300D
Original Publication Date: 1971-Apr-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Boehringer, FH: AUTHOR [+2]

Abstract

A multipin element is removed from a multilayer printed circuit board by simultaneously contacting all pins of a multipin element with a nonwetting heating device from the soldering side of the multilayer printed circuit board, and then extracting the device by an upward motion. This procedure will allow the solder to remain in the via holes of the multilayer printed circuit board since the solder is being drawn toward the heating source, but cannot wet the heating source.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Inserting and Removing of Multipin Elements from a Printed Circuit Board

A multipin element is removed from a multilayer printed circuit board by simultaneously contacting all pins of a multipin element with a nonwetting heating device from the soldering side of the multilayer printed circuit board, and then extracting the device by an upward motion. This procedure will allow the solder to remain in the via holes of the multilayer printed circuit board since the solder is being drawn toward the heating source, but cannot wet the heating source.

A multipin element is inserted into a location having solder already in the via holes by bringing the multipin nonwetting heating element to the location for insertion, heating the area and then inserting the multipin element into the desired location. The multipin nonwetting heating element has holes in the heating element for receiving the leads of the multipin element.

It has been found that by leaving the solder in the via holes after a multipin element has been removed that the internal structure of the multilayer circuit board is not damaged. Also, that the life of the multilayer circuit board is increased by an order of magnitude for each multielement location on the board.

1