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Spreading Resistance Probe

IP.com Disclosure Number: IPCOM000074344D
Original Publication Date: 1971-Apr-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Moerschell, GE: AUTHOR [+2]

Abstract

In resistance testing of the internal conductors of a multilayer ceramic structure a Kelvin Bridge configuration 1 is used. Exterior terminal pads are contacted by pen point shaped split probes 2, 3. Conductive probe elements 2a 3a form a current supply circuit and conductive probe elements 2b, 3b -- which arc electrically isolated from the circuit formed by elements 2a, 3a at insulative bonding junctions 2c, 3c -- form an output measuring circuit. Tip configurations of these probes are designed to induce the tips to spread apart slightly under contact pressure. Probe material stiffness is selected to provide uniform and symmetrical contact pressures. Probe structure is detailed in several views at 4.

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Spreading Resistance Probe

In resistance testing of the internal conductors of a multilayer ceramic structure a Kelvin Bridge configuration 1 is used.

Exterior terminal pads are contacted by pen point shaped split probes 2, 3. Conductive probe elements 2a 3a form a current supply circuit and conductive probe elements 2b, 3b -- which arc electrically isolated from the circuit formed by elements 2a, 3a at insulative bonding junctions 2c, 3c -- form an output measuring circuit. Tip configurations of these probes are designed to induce the tips to spread apart slightly under contact pressure. Probe material stiffness is selected to provide uniform and symmetrical contact pressures. Probe structure is detailed in several views at
4.

The material selected for the conductive sections 4a, 4b of such a probe is tungsten copper (ELKONITE* 10W3). This material provides the stiffness and wearability necessary for production testers. Semicylindrical upper portions of sections 4a and 4b are bonded into a cylindrical configuration by discrete isolation layer 4c of nonconducting adhesive (Minnesota Mining and Manufacturing Co. Bonding Tape No. 588). Lower tip portions 5a, 5b are shaped in a "softened" pen point effect by cylindrical cuts 5 to provide the desired spreading response to contact pressure. The probes are locked in their holders, not shown, using the dimples 6; electrical contact to external equipment is also made at these points. In use, the probes are inclined 45 de...