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Plated Wire Small Hole Lapping

IP.com Disclosure Number: IPCOM000074455D
Original Publication Date: 1971-Apr-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Townsend, TW: AUTHOR

Abstract

This is a method and means for producing high precision miniature holes in the order of hole sizes ranging from 0.009" to 0.037" diameter +/- 0.000050" tolerance. Part 1 is a slip fit on an unplated portion of music wire 2 which is then secured into synchronized turning heads 3 and 4. Next, wire 2 is drawn tight, spun through heads 3 and 4, and part 1 is advanced along copper plated portion 5. Lapping compound is applied to the wire in advance of part 1 to impregnate the copper and provide a lapping action. Part 1 is rough lapped using rough lapping compound and a succession of progressively larger diameter wires, each about 0.0003" larger. Approximately 0.0003" is left for finish lapping with fine lapping compound and progressively larger diameter wires, each about 0.0001" larger.

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Plated Wire Small Hole Lapping

This is a method and means for producing high precision miniature holes in the order of hole sizes ranging from 0.009" to 0.037" diameter +/- 0.000050" tolerance. Part 1 is a slip fit on an unplated portion of music wire 2 which is then secured into synchronized turning heads 3 and 4. Next, wire 2 is drawn tight, spun through heads 3 and 4, and part 1 is advanced along copper plated portion
5. Lapping compound is applied to the wire in advance of part 1 to impregnate the copper and provide a lapping action. Part 1 is rough lapped using rough lapping compound and a succession of progressively larger diameter wires, each about 0.0003" larger. Approximately 0.0003" is left for finish lapping with fine lapping compound and progressively larger diameter wires, each about 0.0001" larger.

Wires are readily sized to desired diameters by applying a flat India Stone to the copper plated portion as the wire is spinning.

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