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Browse Prior Art Database

Heat Transfer Structure for Electronic Subassemblies

IP.com Disclosure Number: IPCOM000074518D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Abstract

Multilayer interconnection circuit boards 10 and 11, with connector 12 attached to the bottom thereof are mounted within a metal heat transfer frame 13 having edge portions 14 and 15 connected by integral heat transfer strips 16. Circuit module flatpacks 17 having leads 18 soldered in a known manner to land patterns formed on boards 10 and 11 are surface bonded to the outer surfaces of strips 16. The bonding material is preferably an adhesive which has good dielectric and thermal conducting properties. This subassembly is mounted between support plates 19 and 20. Pins 21 of connector 12 are plugged into a receptacle, not shown, whereby flatpacks 17 are interconnected with each other and other circuit elements of other subassemblies.

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Heat Transfer Structure for Electronic Subassemblies

Multilayer interconnection circuit boards 10 and 11, with connector 12 attached to the bottom thereof are mounted within a metal heat transfer frame 13 having edge portions 14 and 15 connected by integral heat transfer strips 16. Circuit module flatpacks 17 having leads 18 soldered in a known manner to land patterns formed on boards 10 and 11 are surface bonded to the outer surfaces of strips 16. The bonding material is preferably an adhesive which has good dielectric and thermal conducting properties. This subassembly is mounted between support plates 19 and 20. Pins 21 of connector 12 are plugged into a receptacle, not shown, whereby flatpacks 17 are interconnected with each other and other circuit elements of other subassemblies.

In this structure, heat generated in flatpacks 17 is conducted through strips 16 to edge portions 14 and 15 of frame 13 and then to plates 19 and 20, which may be part of a heat sink structure that is cooled by a cooling medium. To assure efficient heat transfer, edge portions 14 and 15 are provided with special structures for contacting the surfaces of grooves 22 and 23 within plates 19 and 20, respectively. Since the heat transfer structures are identical for both edge portions 14 and 15, only the details for edge portion 14 are shown and described.

As seen in the various Figures, edge portion 14 has flexible thermal extensions 24 and 25. A spring 26 is mounted between extensions...