Browse Prior Art Database

Edge Definition as Related to Angled Electrode Lands

IP.com Disclosure Number: IPCOM000074524D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Kutch, G: AUTHOR

Abstract

In semiconductor component fabrication, the chip is joined to a conductive land pattern which is formed on a ceramic substrate. In conventional practice, drawing A, the conductive land pattern is formed by screening a conductive paste through a mesh screen 10, having a selected pattern, onto a ceramic substrate, not shown. Angled land patterns 11 drawn on grid intersections bisect the mesh holes 12 and these holes are virtually useless for paste flow due to their size after metal etching. Angled lands 13, drawing B, when located halfway between grid intersections 14 and traversing the grid at 45 degrees will provide full mesh holes 15 along the length of the angled land. The land pattern is more effectively covered with nonrestricting paste flow-holes. The mesh holes depicted would be 3.3 or 3.

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Edge Definition as Related to Angled Electrode Lands

In semiconductor component fabrication, the chip is joined to a conductive land pattern which is formed on a ceramic substrate. In conventional practice, drawing A, the conductive land pattern is formed by screening a conductive paste through a mesh screen 10, having a selected pattern, onto a ceramic substrate, not shown. Angled land patterns 11 drawn on grid intersections bisect the mesh holes 12 and these holes are virtually useless for paste flow due to their size after metal etching. Angled lands 13, drawing B, when located halfway between grid intersections 14 and traversing the grid at 45 degrees will provide full mesh holes 15 along the length of the angled land. The land pattern is more effectively covered with nonrestricting paste flow-holes. The mesh holes depicted would be
3.3 or 3.8 mil holes on 5 mil centers in a square array.

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