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IP.com Disclosure Number: IPCOM000074560D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Kennedy, DP: AUTHOR

Abstract

Electric current crowding causes metal migration at the interface of two contacting metals in pad structures. Substantial reduced current crowding is obtained by introducing a high resistance layer 10 between a conventional pad structure comprising lead, interface 12, silicon insulator 14 and aluminum layer 16. Substantial reduction in current crowding is obtained by employing a layer 10 having a resistivity value approximately 103 greater than that of the aluminum.

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Electric current crowding causes metal migration at the interface of two contacting metals in pad structures. Substantial reduced current crowding is obtained by introducing a high resistance layer 10 between a conventional pad structure comprising lead, interface 12, silicon insulator 14 and aluminum layer
16. Substantial reduction in current crowding is obtained by employing a layer 10 having a resistivity value approximately 103 greater than that of the aluminum.

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