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Multilayer Printed Circuit Board Connections

IP.com Disclosure Number: IPCOM000074567D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Thorpe, RA: AUTHOR [+2]

Abstract

A packaging system is described by which interconnections between printed circuit boards may be standardized for mass production. Referring to Drawing A, in the process of fabricating standard multilayer printed circuit boards 1 of rigid construction, additional preprinted layers 2 and 3 of flexible construction are added to the basic configurations. Elements 2 and 3 extend beyond edges of board 1 on two sides, as shown.

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Multilayer Printed Circuit Board Connections

A packaging system is described by which interconnections between printed circuit boards may be standardized for mass production. Referring to Drawing A, in the process of fabricating standard multilayer printed circuit boards 1 of rigid construction, additional preprinted layers 2 and 3 of flexible construction are added to the basic configurations. Elements 2 and 3 extend beyond edges of board 1 on two sides, as shown.

Element 2 provides for establishment of connections between board 1 and similar boards in the x-direction to the left and right of board 1. Unsupported extension 4 of element 2 may connect to the supported portion 5 of a similar element on a board to the right. Similarly supported edge area 5 of element 2 is prepared to receive connection with the unsupported extended portion 4 of a corresponding element on a board to the left.

Similarly unsupported and supported edge areas 6 and 7 of element 3 are prepared for connection to respective supported and unsupported edge areas of corresponding elements on boards, respectively, in front of and behind the board 1 in the y-direction.

Preprinted lines 8 on element 2 are placed in the x-direction and lines 9 on element 3 are in the y-direction. Connections between these lines and internal connections to the board circuits are established by plated holes 11, as detailed in drawing B.

A complete multiboard assembly is shown in drawing C. Note that the assembly pha...