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Variable VIA Copper Ring Size Design with Depth Angle Control

IP.com Disclosure Number: IPCOM000074578D
Publication Date: 2005-Feb-23
Document File: 3 page(s) / 130K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a new variable VIA copper ring size, designed to conserve PCB real estate. Benefits include a solution that is easy to implement and enables more signal routings.

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Variable VIA Copper Ring Size Design with Depth Angle Control

Disclosed is a method for a new variable VIA copper ring size, designed to conserve PCB real estate. Benefits include a solution that is easy to implement and enables more signal routings.

Background

Today commercial electronic products are trending towards smaller sizes, which leads to smaller PCB sizes with smaller component designs. In addition, more and more advanced features are required, which increases the need for more signal routing; thus more PCB real estate is needed. This has caused problems for design engineers and CAD engineers working on small factor form board designs.

Currently, small component design obstacles are overcome by:

§         Using additional PCB layers to enable more routing; however, this makes the product more expensive

§         Using smaller components which are a challenge for assembly processes and testing

§         Using smaller IC footprints

§         Minimizing stress concentrations and strain distributions on the copper ring

General Description

In the disclosed method, the V-shape VIA copper ring has an inclined depth angle between 0<Θ<900 as shown in Figures 1 and 2.  For an A-shaped VIA, the copper ring inclined depth angle is between 900<Θ<1800 as shown in Figure 3.

 

Figure 4 shows the idealized V-shaped via with rounded corner surfaces. Less stress is concentrated on rounded corner surfaces, and this reduces cracks at the copper ring in the SMT reflow process. It also resists board warpage. Fi...