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Browse Prior Art Database

Offset Die Placement in Multilayer Flex Packages

IP.com Disclosure Number: IPCOM000074584D
Publication Date: 2005-Feb-23
Document File: 3 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a silicon device to offset the die center from the BGA array center of a multilayer flex package. Benefits include the ability to place a 10% larger die in the same package.

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Offset Die Placement in Multilayer Flex Packages

Disclosed is a method that uses a silicon device to offset the die center from the BGA array center of a multilayer flex package. Benefits include the ability to place a 10% larger die in the same package.

Background

Currently in the folded stacked CSP program, the maximum die size is in the shape of a  rectangle (see Figure 1). This is due to the folded region in the package being on one particular side. Therefore, the size of the die is limited in the direction of the fold. This limitation on the folded-side die size effects the non-folded side because the die is centered in the package.

To address this problem, the package size is increased to accommodate a larger die size. Since packages are supported in integer increments, a small increase in the maximum die size can lead to a substantial increase in the package size. 

General Description

The disclosed method offsets the die center away from the BGA array center in flex packaging (see Figures 2 and 3). This approach enables a larger die to be used in folded applications. It also enables the placement of passive components while maintaining package size. The following are the process steps for the disclosed method:

1.      Manufacture a multi-layer, polyamide-based substrate using conventional techniques (now being employed for FS-CSP).

2.      Manufacture a multi-layer substrate.

3.      Apply silicon to the package using offset die placement fiducials.

Advantages

The disclosed method...