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Browse Prior Art Database

High Power Multi Chip Packaging

IP.com Disclosure Number: IPCOM000074586D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Jarvela, RA: AUTHOR [+3]

Abstract

This monolithic chip package permits direct heat transfer to an ambient air stream because the chip 16 is mounted directly opposite the heat sink 14.

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High Power Multi Chip Packaging

This monolithic chip package permits direct heat transfer to an ambient air stream because the chip 16 is mounted directly opposite the heat sink 14.

The pins 10 are inserted through the ceramic carrier 12 and electrically connected to the circuit on the ceramic carrier 12 by soldering. The carrier 12 is then bonded to the heat sink 14. Thereafter, monolithic circuit chips 16 are mounted on the ceramic carrier 12 in a balls-up configuration. Then, the pins 10 are inserted through pin insulators 18 and a cap 20 with fold-over tabs 22 placed on the bottom of the package. The tabs 22 are bent and folded into the grooves 24 on either side of the heat fins for the heat sink 14 to complete the package.

Module repair is possible by straightening out the tabs 22 of the cap 20. Since the cap cost is quite small, a new cap can be used after the repairs are completed.

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