Browse Prior Art Database

Wire Extender for Wire Bond

IP.com Disclosure Number: IPCOM000074592D
Publication Date: 2005-Feb-23
Document File: 2 page(s) / 100K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a wire extender that is used as an extension that connects the substrate to the stacked die. Benefits include minimizing wire shorting during package assembly.

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Wire Extender for Wire Bond

Disclosed is a method for a wire extender that is used as an extension that connects the substrate to the stacked die. Benefits include minimizing wire shorting during package assembly.

Background

Currently, there is a long wire bond connection due to the distance from the substrate to the stacked die (see Figure 1); this long wire bond connection can cause wire swaying, wire sweeping, wire shorting, and increased wire tension, all of which can lead to open failures on the units.

The above problems are currently addressed by limiting the number of die stacked in a single package, and by using another package to mount the additional dice (on top of the previous one) to achieve the full number of dice required in a product. Failures due to wire shorting, wire sweeping, and wire swaying are also avoided by mounting dice with different bond pad locations, so that overlap between the wires for the different dice on same side is minimized. However, this solution can only be used with a limited number of die designs.

General Description

The disclosed method’s wire extender is a substrate form of wire extension. It uses a conventional substrate or interposer manufacturing technology. This method simply extends the connection path from the substrate through the metal pads, using tiny solder balls as contacts. Wire bond contact takes place where the metal pads of the wire extender meet the die bond pads.

Figure 2 shows where the wire extender is mounted....