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Improved Pick and Place Socket Cover

IP.com Disclosure Number: IPCOM000074601D
Publication Date: 2005-Feb-23
Document File: 2 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a cover that is placed on a socket to allow it to be picked up by a vacuum nozzle and placed for attachment to a circuit board. Benefits include improved air flow and a feature that automatically disengages the cover in the event that the socket is populated with a processor.

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Improved Pick and Place Socket Cover

Disclosed is a method for a cover that is placed on a socket to allow it to be picked up by a vacuum nozzle and placed for attachment to a circuit board. Benefits include improved air flow and a feature that automatically disengages the cover in the event that the socket is populated with a processor.

Background

The current pick and place cover design allows the cover to remain in place even if the socket is closed with a processor inadvertently left in the socket. The OEM process is unable to detect this failure; therefore, it could result in a field failure once shipped. In addition, the current pick and place cover blocks airflow to the socket solder ball area during reflow, resulting in a cold solder joint (see Figure 1).

Also, there are small openings in the current cover that allow a very limited amount of airflow to the inside of the socket cavity.

General Description

The disclosed method’s pick and place cover incorporates a hollow protrusion feature on the bottom (i.e. socket) side of the cover (see Figure 2). The protrusion is sized to:

§         Fit within the socket center cavity without contacting any portion of the socket

§         Provide a maximum opening for airflow to the center of the socket

§         Be tall enough to automatically “eject” the cover off the socket if the socket is actuated with a processor in place

Advantages

The disclosed method automatically disengages from the socket if there is a processor in the socket, and impr...