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Method for irreversible temperature-indicating materials dispensed on a package body to demonstrate lead-free or leaded minimum/maximum solder-alloy reflow profile compliance

IP.com Disclosure Number: IPCOM000074617D
Publication Date: 2005-Feb-23
Document File: 2 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for irreversible temperature indicating materials dispensed on a package body to demonstrate lead-free or leaded minimum/maximum solder-alloy reflow profile compliance. Benefits include improved functionality, improved performance, and improved ease of implementation.

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Method for irreversible temperature-indicating materials dispensed on a package body to demonstrate lead-free or leaded minimum/maximum solder-alloy reflow profile compliance

Disclosed is a method for irreversible temperature indicating materials dispensed on a package body to demonstrate lead-free or leaded minimum/maximum solder-alloy reflow profile compliance. Benefits include improved functionality, improved performance, and improved ease of implementation.

Background

              Conventionally, extensive failure analysis and visual examination are required to physically demonstrate user compliance of recommended lead-free and leaded solder-alloy reflow minimum/maximum temperature exposure during package to board attach processes.

      Temperature indicating materials are conventionally used for monitoring temperatures in the electronics field, such as the motor case temperature, storage temperature, and operating temperature.

General description

              The disclosed method applies a small dot of a temperature-indicating material. It irreversibly changes appearance whenever its stated temperature is exceeded. The method provides clear and irrefutable evidence of compliance to specified reflow parameters.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing an indicator for minimum/maximum solder reflow temperatures
•             Improved performance due to ensuring that maximum temperatures are not exceeded

•             Improved ease of implementation due to being easy to obtain, apply, and interpret

Detailed description

              The disclosed method is the application of a small dot of temperature-indicating material to package bodies. The material irreversibly changes appearance whenever its stated temperatu...