Browse Prior Art Database

Thermoelectric Attachment to a Heat Sink and a Two-Phase (Liquid/Vapor) System

IP.com Disclosure Number: IPCOM000074624D
Publication Date: 2005-Feb-23
Document File: 2 page(s) / 30K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that attaches a thermoelectric (TEC) module to a heat sink and two-phase (liquid/vapor) system using pure indium. Benefits include improved heat transfer through the interface.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 83% of the total text.

Thermoelectric Attachment to a Heat Sink and a Two-Phase (Liquid/Vapor) System

Disclosed is a method that attaches a thermoelectric (TEC) module to a heat sink and two-phase (liquid/vapor) system using pure indium. Benefits include improved heat transfer through the interface.

Background

Currently, a grease or some thermal interface material is used to attach the TEC to the heat sink and two-phase system (see Figure 1); however, this solution has very low thermal conductivity. Tin-based solders are also used, but suppliers have reported that these solders degrade the TEC, due to the higher yield strength and modulus of the systems.

General Description

The disclosed method pre-coats the TEC ceramic plates with a very thin metal layer
(e.g. copper), and than uses pure indium to solder it to a heat sink and two-phase system (see Figures 2 and 3). Most TECs contain a tin-based solder with a melting point in excess of 200°C, which allows for other solders (with melting temperatures less than ~180°C) to be used as attach materials. Indium solder has a unique combination of properties: a low melting point (157°C), a high elongation (in excess of 30%), and a high thermal conductivity (84W/mK) that make it a much improved attach material over conventional greases or tin-based solders.

Advantages

The following are advantages of the disclosed method:

§         Provides high thermal conductivity (~84 W/mK)

§         Provides a low yield strength and a high elongation, thereby preventing excessive...