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Method for a wireless LAN stacked package with an RF antenna on a silicon paddle

IP.com Disclosure Number: IPCOM000074627D
Publication Date: 2005-Feb-23
Document File: 3 page(s) / 180K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a wireless local area network (WLAN) stacked package with an integrated radio frequency (RF) antenna on a silicon paddle. Benefits include improved functionality, improved performance, and improved cost effectiveness.

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Method for a wireless LAN stacked package with an RF antenna on a silicon paddle

Disclosed is a method for a wireless local area network (WLAN) stacked package with an integrated radio frequency (RF) antenna on a silicon paddle. Benefits include improved functionality, improved performance, and improved cost effectiveness.

Background


              Conventional wireless devices do not have an integrated antenna. Coaxial cables route to an antenna on the product lid, making the WLAN system more difficult to assemble.

              Optimization of antenna length and the line length to the antenna vary from manufacturer to manufacturer. Each design is separate and causes issues with range and signal strength (see Figure 1and 2).

              Wire bond technology conventionally relies on a silicon substrate with tight pitched array of wire bonds connected to bond pads that function as the ball of a ball grid array (BGA) on the low sections of the package.

Description

              The disclosed method is a BGA package with a stacked quad flat package (QFP) and an integrated RF device bonded to metal disks that become a paddle for the land pads. The wire-bond land pads attach directly to the solder ball, eliminating the requirement for a separate substrate. The RF device may be accompanied by a logic device.

              The wire-bond technology can be implemented using the following steps:

1.           Epoxy the silicon disk to the die paddle (see Figure 3).

2.           Add tape to the pads, trim the...