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Oriented Metallic Films

IP.com Disclosure Number: IPCOM000074675D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 13K

Publishing Venue

IBM

Related People

Tu, KN: AUTHOR

Abstract

A method is described for producing Au, Ag and Al films with (100) texture on amorphous substrate, or on a crystalline substrate which has a very thin layer of amorphous phase as surface, and for introducing solute atoms or intermediate phases into the grain boundaries.

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Oriented Metallic Films

A method is described for producing Au, Ag and Al films with (100) texture on amorphous substrate, or on a crystalline substrate which has a very thin layer of amorphous phase as surface, and for introducing solute atoms or intermediate phases into the grain boundaries.

The following problems are addressed herein:

1) The growing of highly (100) textured Au, Ag and Al films on amorphous substrates.

2) The improving of the resistance against electromigration in films of (1) by introducing solute atoms or intermediate phases into tilted type grain boundaries.

Use is made of the texture of thin film. Highly textured thin film will develop tilted type grain boundaries which possess anisotropic character of diffusion. Diffusion along the boundary in any direction parallel to the plane of the film will be relatively difficult because they are normal to the dislocation pipes in these boundaries. Therefore, a textured film will have better resistance against electromigration caused by grain boundary diffusion as described by M. J. Attardo, et al, in the IBM Technical Disclosure Bulletin, May 1971, page 3823. It is known that the face center cubic conducting materials, such as Au, Ag and Al, develop (111) texture when they are deposited on amorphous substrates. The dislocation pipe in (111) tilted type grain boundary has smaller diameter than that in (100) tilted type grain boundary because (100) plane has larger interplanar spacing. Therefore, the latter will ha...