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Ultrasonic Repair Plating of Microscopic Interconnections

IP.com Disclosure Number: IPCOM000074691D
Original Publication Date: 1971-May-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Weisman, RL: AUTHOR

Abstract

The plating equipment includes point-tipped ultrasonically agitated bonding tool 1 adapted for electroplating. In the application, process tool 1 receives continuous plating current from rectifier 2 and intermittent side-to-side ultrasonic agitation by transducer 3 and transducing horn 4. In conjunction with commercial dry film photoresist masks and brush plating solutions the equipment is used to construct microscopic spot plating deposits. The equipment and method are especially useful for customized repair/rework of interconnection elements such as vias 5 in printed circuit devices as a supplement to the basic mass manufacture process. The area adjacent to the intended plating site of via 6 is painted with stop-off lacquer L (Warnow black lacquer) to protect neighboring correctly plated vias' 5.

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Ultrasonic Repair Plating of Microscopic Interconnections

The plating equipment includes point-tipped ultrasonically agitated bonding tool 1 adapted for electroplating. In the application, process tool 1 receives continuous plating current from rectifier 2 and intermittent side-to-side ultrasonic agitation by transducer 3 and transducing horn 4. In conjunction with commercial dry film photoresist masks and brush plating solutions the equipment is used to construct microscopic spot plating deposits. The equipment and method are especially useful for customized repair/rework of interconnection elements such as vias 5 in printed circuit devices as a supplement to the basic mass manufacture process. The area adjacent to the intended plating site of via 6 is painted with stop-off lacquer L (Warnow black lacquer) to protect neighboring correctly plated vias' 5. After cleaning, the active module repair plating is prepared by connecting defective vias such as 6 to cathodic plating voltage through a copper surface layer on the backside of the corresponding part. Then a drop 8 of dalic plating solution is placed in the opening bounding the intended plating site, with air bubbles being expelled. The tool tip of ultrasonic bonding tool 1 transfers a current of 140 to 180 microamps for a three mil diameter via to the surface of the solution in drop 5. An eight mil diameter via can be plated at 200 microamps. Tool 1 which receives pulsed ultrasonic vibrations from transducer 3...