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Browse Prior Art Database

Foam Pad Shock Absorber

IP.com Disclosure Number: IPCOM000074748D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Bouvier, RH: AUTHOR [+3]

Abstract

During the transfer of semiconductor wafers from one carrier to another or their loading into a carrier, the wafer edges become abraded and debris in the form of small silicon chips is produced. Such foreign material is a yield detractor in the fabrication of integrated circuits.

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Foam Pad Shock Absorber

During the transfer of semiconductor wafers from one carrier to another or their loading into a carrier, the wafer edges become abraded and debris in the form of small silicon chips is produced. Such foreign material is a yield detractor in the fabrication of integrated circuits.

Such foreign material may be substantially decreased by employing a foam pad 10 and a wafer carrier 12 having an aperture 14 in its bottom surface. When transfer or loading of the wafers into the carrier 12 is to take place, the foam pad 10 is inserted into aperture 14 to cushion wafers entering the carrier. The carrier 12 has slots 16 into which the edges of semiconductor wafer 18 will rest when the wafer 18 is positioned in the carrier. With the foam pad 10 in place, the edges do not impact on the bottom 19 of the carrier during loading.

After loading is completed, the foam pad 10 may be withdrawn from aperture 14 slowly, and the wafer 18 is gently lowered into resting position in slots 16. The provision of plastic film 20 on the top and bottom of foam pad 10 prevents the foam pad 10 itself from being a source of foreign material. This method of loading may be employed for an individual wafer 18 or for batch transfer of sufficient wafers to load the entire carrier 12.

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