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Metallization of Positive Photoresists

IP.com Disclosure Number: IPCOM000074776D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Peter, AE: AUTHOR

Abstract

Adhesion of metal films to the surface of positive photoresists can be significantly improved by partial exposure and development of the surface prior to metal deposition.

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Metallization of Positive Photoresists

Adhesion of metal films to the surface of positive photoresists can be significantly improved by partial exposure and development of the surface prior to metal deposition.

The usual hard, shiny surface of positive (solubilized by light) photoresists is altered to satisfactorily accept and retain metallization through subsequent processing, by exposing the surface to actinic radiation for about one-eighth the usual exposure time for a 1 mil film. After conventional development, electroless and electrolytic plating are carried out. This permits a positive resist to be used as a dielectric for printed circuits.

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