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Elimination of Pinholes in Metal Films

IP.com Disclosure Number: IPCOM000074791D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cascio, SJ: AUTHOR [+2]

Abstract

Pinholes can be eliminated quickly and reliably in metal films by overplating in an electrochemical bath.

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Elimination of Pinholes in Metal Films

Pinholes can be eliminated quickly and reliably in metal films by overplating in an electrochemical bath.

Vacuum deposited nickel-chromium on glass has pinholes eliminated by electroplating in a bath having high-throwing power capability. A bath of 32 oz. per gal. of nickel chloride, 10 oz. per gal. of hydrochloric acid and water to make one gallon is capable of bridging openings of up to 0.005 inch with current density of 50-100 amps. per sq. ft. Plating is done with live entry of the substrate into the bath and a thief wire to prevent dissolution of the thin-base film.

This process produces good adhesion and abrasion resistance of the added metal.

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