Browse Prior Art Database

Heat Sink Pencil

IP.com Disclosure Number: IPCOM000074797D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Caccoma, GA: AUTHOR [+2]

Abstract

This heat sink pencil provides a solution to the problem of correlating test results of semiconductor chips when tested individually utilizing an automated handler and the test results of the module final assembly. The heat sink creates an environment for a discrete semiconductor device under test conditions, which is thermally equal to that of the next level assembly, the module.

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Heat Sink Pencil

This heat sink pencil provides a solution to the problem of correlating test results of semiconductor chips when tested individually utilizing an automated handler and the test results of the module final assembly. The heat sink creates an environment for a discrete semiconductor device under test conditions, which is thermally equal to that of the next level assembly, the module.

Integrated circuit devices inherently generate heat when powered. This condition creates two major problems when such devices are tested. The device may self-destruct when powered because of high-heat generation. A problem of correlating device characteristics while under test to that of a functional completed module assembly is also created. The heat sink pencil virtually eliminates these problems.

Heat sink 1 is formed on vacuum pencil 2 carried by semiconductor chip handling equipment. Sink 1 is separated from the pencil 2 by insulator 3 and is formed of a heat conductive material such as copper. Multiple cooling fins 4 are formed around the surface of sink 1. A carbide tip 5 is brazed to the end of sink 1 to facilitate wear of the unit. By means of a vacuum provided at 6, a device 7 under test is held to the unit. The device is then subjected to contacting for electrical tests by contactor blades 8.

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