Browse Prior Art Database

External Module Heat Sink Fastened to Board

IP.com Disclosure Number: IPCOM000074816D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Cunavelis, PJ: AUTHOR [+2]

Abstract

This external heat sink is applied to a module to hold the module temperature within a desired level. The removable heat sink is fastened to the board. For a module initially fastened to the board, this allows additional protection against shock and vibration. For pluggable type modules, this allows a means of holding the module in proper contact position.

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External Module Heat Sink Fastened to Board

This external heat sink is applied to a module to hold the module temperature within a desired level. The removable heat sink is fastened to the board. For a module initially fastened to the board, this allows additional protection against shock and vibration.

For pluggable type modules, this allows a means of holding the module in proper contact position.

The heat sink 3 is in contact with the module 1 and fastened to the board 2 through a typical mechanism 4. The mechanism 4, as shown may be spring loaded to compensate for mechanical tolerance or thermal mismatch. A quick release mechanism, such as a spring loaded cam action, can also be incorporated. The module 1 may be attached to the board 2 in various ways, such as, soldered to board via hole 5, or solder bucket 6, or spring loaded contacts 7 and 8, etc.

In order to minimize contact thermal resistance between heat sinks 3 and module 1, a thermal conductive paste or material 9 may be inserted.

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