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Direct Fluid Cooling Chuck

IP.com Disclosure Number: IPCOM000074819D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Edmond, FW: AUTHOR

Abstract

A semiconductor device assembly is held in a leakproof coupling chuck during measurement and test operations. During such an operation, cooling fluid is sealed within the chuck which is adjustable axially and angularly.

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Direct Fluid Cooling Chuck

A semiconductor device assembly is held in a leakproof coupling chuck during measurement and test operations. During such an operation, cooling fluid is sealed within the chuck which is adjustable axially and angularly.

A device assembly 1 is placed between jaws 2 and 3 and a torque screw 4 is turned activating the moving portion of jaw 2. Device assembly 1 is firmly held in position between the jaws of the chuck and the chuck is moved angularly so that contactor assembly 5 seats on seal ring 6. At the same time, diaphragm 7 proportionally collapses making possible contact between device assembly 1 and contactor 5 with a spring force that helps the sealing action. The chuck body is assembled to an insulator plate 8 and this assembly is in turn fastened to a base plate 9. Ball 10 is provided for a floating action, so that the chuck assembly may be leveled in a horizontal direction.

Diaphragm 7, as a flexible member, permits X, Y and phi adjustment. Through a drain filler, not shown, the chuck is filled with cooling fluid while the test operation is being performed. After the test operation is completed, the loading operation is reversed.

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