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Browse Prior Art Database

Semiconductor Module Structure

IP.com Disclosure Number: IPCOM000074861D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-23
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Ainslie, NG: AUTHOR [+3]

Abstract

Microelectronic semiconductor chips may be mounted on ceramic or other insulative substrates bearing a conductive land pattern. The joints between the chip and supporting substrates are accomplished by a plurality of solder pads, which rest on land patterns on the substrate to provide both electrical connection between the chip and the conductive land patterns, as well as support for the chip. These pad joints have been found to be subject to mechanical stress due to differences of thermal expansion between the chip and the substrate. In particular, pads on the periphery of the chip, which is a common pad location, are subject to such stresses.

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Semiconductor Module Structure

Microelectronic semiconductor chips may be mounted on ceramic or other insulative substrates bearing a conductive land pattern. The joints between the chip and supporting substrates are accomplished by a plurality of solder pads, which rest on land patterns on the substrate to provide both electrical connection between the chip and the conductive land patterns, as well as support for the chip. These pad joints have been found to be subject to mechanical stress due to differences of thermal expansion between the chip and the substrate. In particular, pads on the periphery of the chip, which is a common pad location, are subject to such stresses.

The present structure is intended to minimize such thermal stresses on the peripheral joints. Ceramic substrate 10 bears conductive lands 11 and 12, on which are mounted pads 13 and 14, to connect semiconductor chip 15 to the substrate. The chip is coated with an insulating layer 16, e.g., glass. A standoff, such as 17, positioned as close as possible to the center of gravity of the chip acts to minimize the effect of any mechanical strains on the peripheral joints. Standoff 17 may be made of the same solder material as pads 13 and 14. However, it preferably performs no electrical connection between the chip and the substrate. Instead of a single standoff, a plurality of standoffs symmetrically arranged about the center of gravity may be used.

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