Browse Prior Art Database

Flip Chip Module with Volume Staggering of Joints

IP.com Disclosure Number: IPCOM000074883D
Original Publication Date: 1971-Jun-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Goldmann, LS: AUTHOR

Abstract

The interconnecting joints between a semiconductor chip and a substrate are nonuniform by differing in shape. A volume differential causes a stiffness differential in the interconnecting joints.

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Flip Chip Module with Volume Staggering of Joints

The interconnecting joints between a semiconductor chip and a substrate are nonuniform by differing in shape. A volume differential causes a stiffness differential in the interconnecting joints.

By making the pads or joints furthest from the center of the chip thinner and those closest to the center of the chip heavier, the shear stress is equalized on every pad without changing the chip-to-substrate height or neutral point, and without off-balancing the chip. Chip 10 is joined to substrate 11 by a plurality of pads or joints. The interconnecting joints 12 having the greater stiffness are located as the inner joints. The outer joints 13 have a decreased stiffness. Thus, those joints which are subject to the greatest thermal displacement or strain have greater ability to absorb strain than those joints subject to a lesser strain. All of the joints 12, 13 are electrically active and may be connected to a passive or active element in chip 10.

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