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Solder Bucket Loading Fixture

IP.com Disclosure Number: IPCOM000074958D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Sarnacki, FH: AUTHOR

Abstract

In microminiaturizations of electronic systems, the individual circuit elements are often attached to the substrate surfaces by use of a plurality of solder balls. Generally a substrate is provided with a plurality of tapered bores, having frustum conical side wall configurations referred to as solder buckets.

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Solder Bucket Loading Fixture

In microminiaturizations of electronic systems, the individual circuit elements are often attached to the substrate surfaces by use of a plurality of solder balls. Generally a substrate is provided with a plurality of tapered bores, having frustum conical side wall configurations referred to as solder buckets.

This fixturing device is adapted to load solder balls into the solder buckets. The device comprises base member 1, preferably of plexiglass material, having recessed area 2 therein and an overlying fixture 3, also of plexiglass material, with a predetermined pattern of tapered holes 4 adapted to receive a solder ball 5 in each of the holes 4. Solder balls 5 are held in holes 4 by vacuum means applied to recessed area 2 through port 6. Alignment of the fixturing device in proper registration with the corresponding solder ball receiving locations on the substrate is visually accomplished by looking through the plexiglass fixture. When the alignment has been completed, the vacuum is released and the solder balls 5 are dropped into their respective locations on the substrate.

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