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Organo Metallic Solder Fluxes

IP.com Disclosure Number: IPCOM000074961D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Albrecht, WM: AUTHOR [+3]

Abstract

The addition of copper to organic acids provides fluxes which are characterized by improved solder spreading and wetting on solderable substrate such as copper - nickel, and conventionally unsolderable substrates,such as iron, stainless steel, and KOVAR*. For example, copper oxide (Cu(c)O) added to molten adipic acid provides a metallic complex that is usable a flux with 63/37 Sn/Pb solder, or 5-3-2 Sn - Pb - In at 400 to 500 degrees C soldering temperature and which has increased solder wetting characteristics. The heat required to melt the solder causes a thin film of copper to be deposited onto the heated substrate. Other organo-metallic fluxes have been experimentally developed by the addition of Cu(2)O to other acids such as mandelic, hippuric, and hexanoic acids. *Trademark of Westinghouse Electric Corporation.

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Organo Metallic Solder Fluxes

The addition of copper to organic acids provides fluxes which are characterized by improved solder spreading and wetting on solderable substrate such as copper - nickel, and conventionally unsolderable substrates,such as iron, stainless steel, and KOVAR*. For example, copper oxide (Cu(c)O) added to molten adipic acid provides a metallic complex that is usable a flux with 63/37 Sn/Pb solder, or 5-3-2 Sn - Pb - In at 400 to 500 degrees C soldering temperature and which has increased solder wetting characteristics. The heat required to melt the solder causes a thin film of copper to be deposited onto the heated substrate. Other organo-metallic fluxes have been experimentally developed by the addition of Cu(2)O to other acids such as mandelic, hippuric, and hexanoic acids. *Trademark of Westinghouse Electric Corporation.

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