Browse Prior Art Database

Dielectric Sputtering for Multilayer Circuitry

IP.com Disclosure Number: IPCOM000074975D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Cortellino, CA: AUTHOR [+3]

Abstract

The following process makes use of a water soluble polymer such as polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), etc., which has been covered with a water soluble light sensitive photoresist to form the etch resist for the underlying polymer.

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Dielectric Sputtering for Multilayer Circuitry

The following process makes use of a water soluble polymer such as polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), etc., which has been covered with a water soluble light sensitive photoresist to form the etch resist for the underlying polymer.

The areas of the photoresist that are exposed to actinic light become water insoluble. The exposed sensitized sample is developed in water. Concomitant with development, etching of the water soluble polymer also occurs, thus combining etching and developing into one operation.

By sensitizing a water soluble resist, such as Emulsitone (from Emulstone Co.) with ammonium dichromate, it is not necessary to remove the resist layer, since there would be no contamination to the circuit as opposed to using the sodium salt of dichromate.

Final connections can be made to each layer by plating vias through the image. The dielectric film is able to withstand 350 degrees C temperatures such as that encountered in hot solder operations.

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