Browse Prior Art Database

Adhesive Conducting Tape for EMC Closures

IP.com Disclosure Number: IPCOM000075000D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Damm, EP: AUTHOR [+4]

Abstract

This adhesive conducting tape establishes electrical contact between movable and stationary housing elements of an electronic circuit assembly. The requirement for such contact is established by EMC (Electromagnetic Compatibility) shielding specifications.

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Adhesive Conducting Tape for EMC Closures

This adhesive conducting tape establishes electrical contact between movable and stationary housing elements of an electronic circuit assembly. The requirement for such contact is established by EMC (Electromagnetic Compatibility) shielding specifications.

The tape consists of a layer of adhesive plastic of uniform predetermined thickness, supported on a metallic foil conductive substrate. The adhesive contains a moderately sparse but uniformly distributed mixture of generally spherical preselected conductive particles, having uniform diameters equal to the adhesive layer thickness.

The tape is fastened in strips to prespecified areas of closure on the circuit housing frame. In order to ensure contact between the particles in the adhesive and the frame, the surface of the adhesive layer can be slightly burnished off prior to fastening; thereby slightly exposing the conductive particle surfaces. Alternately, an adhesive plastic which flows at points of contact pressure can be used. The sparse distribution of the conductive particles allows the adhesive layer to reliably bond to the frame.

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