Browse Prior Art Database

Modular 3 D Connector Structures

IP.com Disclosure Number: IPCOM000075049D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Toomey, RA: AUTHOR

Abstract

Densely packaged arrays of discrete multidirection lead connections, in tightly confined spaces, are constructed as follows: 1) Tin-lead framing wires are formed smoothly into predetermined shapes and clamped in a supporting fixture. 2) Water or other solidifiable liquid is poured into the fixture and frozen or congealed to form a cubic mold. 3) The framing wires are unclamped and pulled out of the mold, leaving a 3-D pattern of connecting passages in the mold. 4) Insulated connecting wires coated with smooth insulation (e.g. copper coated with TEFLON* or urethane) are threaded through the passages in the mold. 5) Ends of the threaded connecting wires are secured and the mold is melted, leaving the wires centrally unsupported.

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Modular 3 D Connector Structures

Densely packaged arrays of discrete multidirection lead connections, in tightly confined spaces, are constructed as follows:
1) Tin-lead framing wires are formed smoothly into predetermined

shapes and clamped in a supporting fixture.
2) Water or other solidifiable liquid is poured into the fixture

and frozen or congealed to form a cubic mold.
3) The framing wires are unclamped and pulled out of the mold,

leaving a 3-D pattern of connecting passages in the mold.
4) Insulated connecting wires coated with smooth insulation (e.g.

copper coated with TEFLON* or urethane) are threaded through

the passages in the mold.
5) Ends of the threaded connecting wires are secured and the mold

is melted, leaving the wires centrally unsupported.
6) The unsupported connecting wires are potted in an appropriate

polymer potting compound providing requisite central support.
7) For RFI/EMI isolation smooth-surfaced coaxial lines may be

threaded in place

of the connecting wires. Alternately, conductive shield

coatings may be electrolessly deposited on the insulation

covering the unsupported

connecting wires before potting, or a conductive

potting material may be used to define the shield.
8) The connecting and shielding conductors extending from the

potted mass are appropriately terminated for connection to

external devices. *Trademark of E. I. du Pont de Nemours & Co.

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