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Thin Film Stripes for Electronic Interconnection

IP.com Disclosure Number: IPCOM000075072D
Original Publication Date: 1971-Jul-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

d'Heurle, FM: AUTHOR

Abstract

Thin film conductors used in electronic devices undergo various types of failure resulting from current-induced mass-transport (also known as electromigration). The occurrence of such failures in aluminum stripes is well known. It is possible to formulate a generalized theory for prediction of beneficial additions to reduce electromigration in conductors. Such a theory requires that alloying additions should fulfill two conditions:.

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Thin Film Stripes for Electronic Interconnection

Thin film conductors used in electronic devices undergo various types of failure resulting from current-induced mass-transport (also known as electromigration). The occurrence of such failures in aluminum stripes is well known. It is possible to formulate a generalized theory for prediction of beneficial additions to reduce electromigration in conductors. Such a theory requires that alloying additions should fulfill two conditions:.

(a) the atomic diameter of the addition must be considerably different from that of the host material and;

(b) the solubility limit of the addition in the host material must not be too limited. In general, what is wanted is a high concentration of "adsorbed" alloying atoms on the grain boundaries of the host material.

Since, other things being equal, the rate of failure is proportional to the diffusion coefficients, a significant reduction in the failure rate is obtained through the use of Ag or Au in lieu of aluminum. Yet, dele deleterious phenomena due to electromigration, such as growth formation and microscopic mass transport which lead to the formation of shorts or the destruction of protective layers, are observed both in Au and Ag stripes which have undergone current stressing.

Considerations outlined above indicate that for Ag and Au the following additions would be beneficial: Ag Au

Cu Cu

Zn Zn

Ga Ga

Ge Ge

As

Mg Mg

Ni

Fe.

All of these additions, in the desired amounts of about...