Browse Prior Art Database

Making Integral Multilayer Circuit Boards With Cable Connection

IP.com Disclosure Number: IPCOM000075121D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 82K

Publishing Venue

IBM

Related People

Ardito, FP: AUTHOR [+2]

Abstract

Circuit sheets 10 comprising copper layer 11 bonded by an adhesive 18 or plated to a dielectric material 12, and bonding sheets 13 of an adhesive material are initially cut to a common size. The circuit sheets are relatively thin so as to be individually flexible. At the time of cutting adhesive sheets 13 or alternatively in a successive operation, a window 14 is cut in the region corresponding with the flexible connector section of the circuit board package. After circuit patterns 16 have been formed in the copper layers 11 of the various circuit sheets 10 and the circuit sheets 10 have been cleaned for lamination, the bonding and circuit sheets are stacked in an interleaved manner as shown in Fig. 1, for example. Release inserts 15 of nonbonding material are placed in the windows 14 of the bonding sheets 13.

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Making Integral Multilayer Circuit Boards With Cable Connection

Circuit sheets 10 comprising copper layer 11 bonded by an adhesive 18 or plated to a dielectric material 12, and bonding sheets 13 of an adhesive material are initially cut to a common size. The circuit sheets are relatively thin so as to be individually flexible.

At the time of cutting adhesive sheets 13 or alternatively in a successive operation, a window 14 is cut in the region corresponding with the flexible connector section of the circuit board package.

After circuit patterns 16 have been formed in the copper layers 11 of the various circuit sheets 10 and the circuit sheets 10 have been cleaned for lamination, the bonding and circuit sheets are stacked in an interleaved manner as shown in Fig. 1, for example. Release inserts 15 of nonbonding material are placed in the windows 14 of the bonding sheets 13. The stack is then placed in a lamination press, and pressure and heat applied for a time sufficient to cause the adhesive sheets 13 to become bonded to the circuit sheets 10. After cooling the laminated stack, via holes are formed to interconnect various layers of the circuit package. The final circuit board is then cut to size and shape, for example, along dotted line 17 thereby exposing release sheets 15 for removal from between the circuit sheets 10 in the region desired to be flexible. If desired, a second finish cut can be made after the release sheets 15 have been removed. The final circu...