Browse Prior Art Database

Carrier Card Assembly for Component Aging

IP.com Disclosure Number: IPCOM000075147D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Bruder, SI: AUTHOR [+2]

Abstract

This carrier card assembly is employed in performing electrical component accelerated life tests (aging). The assembly withstands long exposure to high temperature and humidity conditions. The components under test are properly oriented and inserted into test socket 1. Socket 1 is soldered to the land pattern of aging card 2. Heat seal and card support 3 provide a heat sealing effect when aging card 2 is inserted into the oven door (wall). Guard rail 4 protects the components under test, and guides the assembly during the loading process.

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Carrier Card Assembly for Component Aging

This carrier card assembly is employed in performing electrical component accelerated life tests (aging). The assembly withstands long exposure to high temperature and humidity conditions. The components under test are properly oriented and inserted into test socket 1. Socket 1 is soldered to the land pattern of aging card 2. Heat seal and card support 3 provide a heat sealing effect when aging card 2 is inserted into the oven door (wall). Guard rail 4 protects the components under test, and guides the assembly during the loading process.

After insertion, the assembly is locked securely to the oven door (wall) by quick fasteners 5. Two printed circuit board connectors 6 are also soldered to the land pattern of aging card 2. Load card 7 is inserted into connectors 6. A carrier card handle and load card 8 provide a rigid support for the assembly and load card 7, and a handling means for the operator. The aging card is made in one piece, therefore resistance is at a minimum, and no open contacts exist. The load card can be changed with a simple insertion operation.

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