Browse Prior Art Database

Electroforming Metal Mask Process

IP.com Disclosure Number: IPCOM000075152D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Franklin, RH: AUTHOR

Abstract

Cavity masks are formed by a two-step electroplating process.

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Electroforming Metal Mask Process

Cavity masks are formed by a two-step electroplating process.

As shown in Fig. A, a layer 1 of photoresist is applied to a clean aluminum sheet or mandrel 2 and a resist image 3 is developed in either the form of a complete or partial screen pattern (Fig. B). The exposed areas are then electroplated to form nickel screen 4 and resist layer 1 is removed. A new layer of resist 5 is then placed over mandrel 2 and nickel screen 4 (Fig. C). Resist 5 is imaged and developed (Fig. D). The exposed areas of screen 4 and mandrel 2 are then nickel plated by immersing mandrel 2 in an electroplating bath (Fig. E). Resist 5 is dissolved in ethylene dichloride (Fig. F). Mandrel 2 is then immersed in sodium hydroxide in order to loosen finished nickel cavity mask 6 from the mandrel (Fig. G).

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