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Polishing Apparatus

IP.com Disclosure Number: IPCOM000075171D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Hayes, D: AUTHOR [+4]

Abstract

Shown is a random polishing apparatus particularly adapted for polishing orthoferrite crystals or semiconductor wafers. A table 10 having a polishing slurry has mounted thereover a ring 11 in which is housed a plate 12. In the present instance, the plate has four apertures 13, into which into which may be positioned slug 14s. On the lower surface of each slug is mounted, as by a wax, a semiconductor wafer or other workpiece 15, one side of which is to be polished.

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Polishing Apparatus

Shown is a random polishing apparatus particularly adapted for polishing orthoferrite crystals or semiconductor wafers. A table 10 having a polishing slurry has mounted thereover a ring 11 in which is housed a plate 12. In the present instance, the plate has four apertures 13, into which into which may be positioned slug 14s. On the lower surface of each slug is mounted, as by a wax, a semiconductor wafer or other workpiece 15, one side of which is to be polished.

To effect movement in a random manner of the workpiece 15 across the surface of the table 10, the ring 11 is provided with a pair of circumferentially spaced ears 16 and 17, respectively, the ears being arranged perpendicular to one another. As shown, the ears are pivotably connected to push rods 18 and 19, which are respectively connected to hydraulic cylinders 20 and 21. These hydraulic cylinders are, respectively, pivotably mounted at the ends 22 and 23. By varying the push and retract frequency of the push rods 18 and 19, a random motion of the ring 11 is effected. Thus to effect a random motion, it is only necessary that one of the hydraulic cylinders be operated at a different frequency or rate than the other.

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