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Prevention of Solute Depletion During Electromigration in Thin Films

IP.com Disclosure Number: IPCOM000075178D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Rosenberg, R: AUTHOR

Abstract

This method prevents loss of solute by electromigration in metallic stripes, and leads to greatly increased effectiveness of the solute in inhibiting electromigration damage of the solvent.

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Prevention of Solute Depletion During Electromigration in Thin Films

This method prevents loss of solute by electromigration in metallic stripes, and leads to greatly increased effectiveness of the solute in inhibiting electromigration damage of the solvent.

It has been shown previously that the addition of solute to a metallic film inhibits the electromigration rate of the solvent ions in the case where grain boundary diffusion predominates. It has been postulated that the effectiveness of the solute stems from its ability to segregate to grain boundary defects, which normally serve as diffusion paths and immobilize the diffusing species.

A major problem concerning the use of such solute addition is the experimental observation that the solute species is subject to electromigration. Consequently, there results local depletion of solute (solute 1) and ultimately significant damage of the solvent stripe. A method is provided for preventing the electromigration of the solute, thus greatly increasing the lifetime of the stripe. A second carefully selected solute (solute 2) is added subsequent to thermal preparation of the stripe for controlled distribution of solute 1. Solute 2 will migrate to the boundary defects containing solute 1, and because of elastic energy considerations around the defect it will form a complex with solute 1. In this instance, the boundary defect will be tied up by solute 1 such that the electromigration is inhibited, and the solute 1 will b...