Browse Prior Art Database

Manufacture of Hybrid Integrated Circuits

IP.com Disclosure Number: IPCOM000075284D
Original Publication Date: 1971-Aug-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Denk, HH: AUTHOR

Abstract

Circuit patterns are generated by a dry transfer process employing conductive paste previously coated and allowed to dry on a polyester web.

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Manufacture of Hybrid Integrated Circuits

Circuit patterns are generated by a dry transfer process employing conductive paste previously coated and allowed to dry on a polyester web.

A silver palladium paste, while wet, is applied as a film about 0.00015" thick on a 0.0005" thick polyester web or sheet. After the paste dries, the web or sheet is slit into narrow webs and wound on rolls. Ceramic substrates are successively incremented relative to a rotary or reciprocating stamping member having a raised circuit pattern corresponding to the pattern desired. The polyester web, with its paste-coated side facing the substrate, is incremented between the member and substrate so that dried paste conforming to the desired pattern is pressure transferred from the web to the substrate.

By preheating the ceramic substrate to about 250 degrees F., and imprinting the desired pattern thereon using a stamping member at ambient temperature, transfer was effected at lower contact pressures and with less "squash-out" and better line definition than was achieved using a normal hot-stamping transfer, which required long dwell times at high pressure and temperature to obtain good adhesion.

Resolution of at least 0.004" was maintained. When tinned, the patterns provided lands having a resistance around 10 micro-ohms per centimeter.

If preferred, the conductive paste may comprise platinum, gold, copper or nickel provided electrical, physical, and chemical criteria are satisfied. Also,...