Browse Prior Art Database

Producing a Multilayer Glass Metal Module

IP.com Disclosure Number: IPCOM000075363D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Rasile, J: AUTHOR [+2]

Abstract

In this method a first blanket layer 10 of chromium and a second blanket layer 12 of copper are deposited by evaporation techniques on glass coated ceramic substrate 14, as shown in Fig. 1. Alternately, a single layer of electrolessly deposited nickel could be substituted for 10 and 12. A layer of sheet photoresist 16, for example, RISTON*, is then applied over the layer 12. A pattern is then exposed and developed which corresponds to the desired metallurgy, and metallurgy pattern 18 electroplated, using layers 10 and 12 as the electrode as shown in Fig. 2. The top surface is then lapped even with the RISTON and a second solid photoresist layer 20 deposited over layer 16, and a desired pattern of via holes exposed and developed. Stud 22 is electroplated as shown in Fig. 3.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Producing a Multilayer Glass Metal Module

In this method a first blanket layer 10 of chromium and a second blanket layer 12 of copper are deposited by evaporation techniques on glass coated ceramic substrate 14, as shown in Fig. 1. Alternately, a single layer of electrolessly deposited nickel could be substituted for 10 and 12. A layer of sheet photoresist 16, for example, RISTON*, is then applied over the layer 12. A pattern is then exposed and developed which corresponds to the desired metallurgy, and metallurgy pattern 18 electroplated, using layers 10 and 12 as the electrode as shown in Fig. 2. The top surface is then lapped even with the RISTON and a second solid photoresist layer 20 deposited over layer 16, and a desired pattern of via holes exposed and developed. Stud 22 is electroplated as shown in Fig. 3. Layers 16 and 20 of solid photoresist are then striped and the exposed portions of layers 10 and 12 etched. A thin layer 24 of electroless nickel is deposited over the circuit pattern and studs, and glass passivating layer 26 is deposited on the surface of substrate 14 covering the circuit pattern. The top surface is then lapped to expose the studs and fire polished. The desired module circuit is built up by repeating the process until the required number of layers is achieved. * Trademark of E. I. du Pont De Nemours & Co.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]