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Substrate Materials having Low Sintering Temperatures and Low Dielectric Constants

IP.com Disclosure Number: IPCOM000075367D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Agajanian, AH: AUTHOR

Abstract

This ceramic glass composite material is particularly suited for the fabrication of ceramic substrates because it sinters at low temperatures on the order of 1000 degrees C in air, has a low dielectric constant on the order of 7 and dissipation factor on the order of 0.001.

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Substrate Materials having Low Sintering Temperatures and Low Dielectric Constants

This ceramic glass composite material is particularly suited for the fabrication of ceramic substrates because it sinters at low temperatures on the order of 1000 degrees C in air, has a low dielectric constant on the order of 7 and dissipation factor on the order of 0.001.

Conventional alumina substrate materials sinter at relatively high temperatures on the order of 1400 degrees C. In the fabrication of substrates wherein conductive lines are deposited prior to sintering, this high temperature seriously limits the choice of conductor materials.

In the composition, B-Al-Mg glass in amounts on the order of 10 to 20% are added to MgAl(2)O(4) powder. The powder was prepared by standard ceramic procedure using high reactivity Al(2)O(3) and MgCl(3) as raw materials. During ball milling, alcohol was used as a vehicle and the powder calcined in the range of 700 degrees to 900 degrees C. The B-Al-Mg glass having a weight percent composition of 50% B(2)O(3), 10% Al(2)O(3) and 40% MgO was formed by mixing the ingredients, melting in a platinum crucible at 1450 degrees C for one hour, quenching to room temperature, pulverizing, and melting at 1200 degrees C for one hour. Discs were cast from the melt which were annealed at 700 degrees C for 1 1/2 hours. Part of the discs were then pulverized and the composition formed by mixing 10 to 20% of the glass powder with 90 to 80% of the MgAl(2)O(3)...