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Top Surface Metallurgy Process

IP.com Disclosure Number: IPCOM000075383D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Rasile, J: AUTHOR [+2]

Abstract

The process is used to deposit two or more heights of metallurgy on the same substrate, such as glass or ceramic. The following is a specific example of the process.

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Top Surface Metallurgy Process

The process is used to deposit two or more heights of metallurgy on the same substrate, such as glass or ceramic. The following is a specific example of the process.

A chromium layer 10 and then a copper layer 12 are vacuum deposited upon ceramic substrate 14. The composite top surface pattern is etched using conventional photoresist techniques to obtain the Fig. 1 structure. A nickel layer 16 is then electroplated on top of certain of the copper areas as shown in Fig. 2. The areas not to be electroplated are covered by a photoresist layer applied by conventional techniques.

Liquid photoresist, 25% RISTON* dissolved in methylene chloride, is applied to the substrate by dip coating. This photoresist layer 18 fills the gaps between the personality pattern. RISTON film photoresist 20 is laminated to the surface. The exposure and development process works concurrently for both liquid and thick-film resist which results in openings to the non-nickel coated copper areas. A copper layer 22 and then a nickel-gold layer 24 are electroplated onto the non- nickel coated areas, resulting in Fig. 3. The photoresist is then removed to produce the final two-level metallurgy of Fig. 4. * Trademark of E. I. du Pont de Nemours & Co.

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