Browse Prior Art Database

Multilevel Connector Pad Module

IP.com Disclosure Number: IPCOM000075399D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Audi, RD: AUTHOR

Abstract

A module 10, such as a multilayer ceramic module, has large pads 12 positioned in a staggered relationship on first and second levels 14 and 16 of the module to which fine, closely spaced wires 18 are connected. The module has a conductive lead 20 connected to each pad 12, as indicated in Fig. 2, which is a section of Fig. 1 taken through 2-2. Wires 18 from wire carrier or support 22 are connected to pads 12 by solder joints 24.

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Multilevel Connector Pad Module

A module 10, such as a multilayer ceramic module, has large pads 12 positioned in a staggered relationship on first and second levels 14 and 16 of the module to which fine, closely spaced wires 18 are connected. The module has a conductive lead 20 connected to each pad 12, as indicated in Fig. 2, which is a section of Fig. 1 taken through 2-2. Wires 18 from wire carrier or support 22 are connected to pads 12 by solder joints 24.

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