Browse Prior Art Database

Automatic Loading of Oxidation Boats

IP.com Disclosure Number: IPCOM000075430D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Goth, GR: AUTHOR [+2]

Abstract

In the processing of semiconductor wafers, air slides are used to unload wafers from carriers, such as oxidation boats. The wafers are then coated with photoresist or other process steps are carried out on them, then they are returned to the oxidation boat. The oxidation boats are made of quartz, or some other high-temperature resistant material, so that they can withstand the oxidation temperatures employed in integrated circuit fabrication, typically around 1100 degrees C. Even in the case of quartz, some warpage of the oxidation boats does occur at these temperatures. This has caused a problem because the warped oxidation boats cannot be properly indexed to an air slide. A modular oxidation boat will solve this problem. An insert 10 for a modular oxidation boat is shown in Fig.

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Automatic Loading of Oxidation Boats

In the processing of semiconductor wafers, air slides are used to unload wafers from carriers, such as oxidation boats. The wafers are then coated with photoresist or other process steps are carried out on them, then they are returned to the oxidation boat. The oxidation boats are made of quartz, or some other high-temperature resistant material, so that they can withstand the oxidation temperatures employed in integrated circuit fabrication, typically around 1100 degrees C. Even in the case of quartz, some warpage of the oxidation boats does occur at these temperatures. This has caused a problem because the warped oxidation boats cannot be properly indexed to an air slide. A modular oxidation boat will solve this problem. An insert 10 for a modular oxidation boat is shown in Fig. 1 undergoing loading of semiconductor wafers 12 from air slide 14. Air jets 16, having a right to left component of velocity, suspend semiconductor wafers 12 above the surface 18 of air slide 14 and move them into slots 20 of insert 10, which are successively indexed in position to receive a wafer 12 from air slide 14 by indexing means 22.

A plurality of inserts 10 loaded with semiconductor wafers 12 are mounted on modular oxidation boat 24, as shown in Fig. 2, to undergo oxidation. Because only the smaller inserts 10 need be registered with air slide 14, warpage of the quartz during oxidation does not cause a significant registration problem when th...