Browse Prior Art Database

Semicontinuous Evaporation System

IP.com Disclosure Number: IPCOM000075431D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Zider, RE: AUTHOR

Abstract

This semicontinuous evaporation system enables a high throughput to be obtained and eliminates the necessity for breaking vacuum in its main deposition chamber 10, each time a new batch of substrates for deposition is entered. The system has a load vacuum lock 12 and an unload vacuum lock 14. Trolley 16 serves to introduce both substrate dome 18 carrying a plurality of semiconductor wafers 20 on which vacuum evaporation is to be carried out, and source cup 22 containing a charge of material to be vacuum evaporated on wafers 20, such as lead-tin solder, into main deposition chamber 10. Disposed within the main deposition chamber 10, is a mechanism for lowering the source cup 22 to deposition position after it has been transported inside main chamber 10 on trolley 16.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 55% of the total text.

Page 1 of 2

Semicontinuous Evaporation System

This semicontinuous evaporation system enables a high throughput to be obtained and eliminates the necessity for breaking vacuum in its main deposition chamber 10, each time a new batch of substrates for deposition is entered. The system has a load vacuum lock 12 and an unload vacuum lock 14. Trolley 16 serves to introduce both substrate dome 18 carrying a plurality of semiconductor wafers 20 on which vacuum evaporation is to be carried out, and source cup 22 containing a charge of material to be vacuum evaporated on wafers 20, such as lead-tin solder, into main deposition chamber 10. Disposed within the main deposition chamber 10, is a mechanism for lowering the source cup 22 to deposition position after it has been transported inside main chamber 10 on trolley 16. The drawing shows a telescoping lift apparatus 26, but a rack and pinion mechanism could also be used, as well as a pneumatic mechanism. RF coils 28 act as a source of heat for source cup 22 when it is in deposition position.

In operation, a dome 18 containing semiconductor wafers 20 is loaded onto trolley 16 through lid 30 in load vacuum lock 12 together with a source cup 22. Load lock 12 is then pumped down to a desired vacuum, and load-lock gate valve 32 is opened to allow trolley 16 to pass into main vacuum chamber 10 which is maintained in vacuum conditions at all times. When trolley 16 is in place within main vacuum chamber 10, magnet 34 on dome rotation mechani...