Browse Prior Art Database

Chip Crack Preventing Method

IP.com Disclosure Number: IPCOM000075432D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Berger, RG: AUTHOR [+4]

Abstract

This method reduces the production of cracks in protective glass used to passify and protect integrated circuit chips.

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This is the abbreviated version, containing approximately 100% of the total text.

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Chip Crack Preventing Method

This method reduces the production of cracks in protective glass used to passify and protect integrated circuit chips.

Flip mounted integrated circuit chips are usually covered with a layer of glass material prior to mounting on circuit modules. Post dicing handling methods such as vibrating bowl feeders and other equipment induce chip-to-chip impacts which may crack the glass coating , resulting in cracked conductors, underlayer damage and exposed chip surfaces. The cracking problem may be reduced by mixing a quantity of resilient chip-sized particles with the chips. Vibrating bowl separation techniques are not hindered by this method, as separation and alignment means will reject the added material because of the lack of identifying protrusions normally used to separate and align actual chips.

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