Browse Prior Art Database

Integrated Circuit Chip Aligner

IP.com Disclosure Number: IPCOM000075474D
Original Publication Date: 1971-Sep-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Eide, SL: AUTHOR

Abstract

This tool allows precise positioning of face down, or flip chip, integrated circuit chips by aligning by solder pad position rather than by perimeter alignment.

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Integrated Circuit Chip Aligner

This tool allows precise positioning of face down, or flip chip, integrated circuit chips by aligning by solder pad position rather than by perimeter alignment.

The tool consists of a linear transporter assembly 1 which feeds the chips 2 from a supply to pad locator 3. Forward pads 4 on the chip fall into the forward cavity 5 while rear pads 6 rest on engaging keys 7. Design of the cavities and keys on the pad locator 3 are personalized for particular pad layouts. A sensing means senses presence of chip in the forward position, leaving them in the tilted position as shown in Fig. 2. Vacuum is applied through port 8 and pad locator 3 is moved to a raised position allowing properly aligned chips to seat fully on pad locator 3, as shown by phantom lines in Fig. 2. Alternately, vacuum may be applied directly to the pad areas avoiding contact with the chip surface. Misoriented chips remain in the tilted position. A second sensing device detects misoriented chips which may be blown from pad locator 3 by a blast of air.

In the raised position pad locator 3 may be rotated around a vertical axis to any desirable position. A pickup means, not shown, may then be lowered to pick up chip 2 as the vacuum to port 8 is reduced. Pad locator 3 returns to its lower position ready for the next chip.

The ability to orient chips from pads, rather than edges of chips, increases accuracy of placement on circuit modules by eliminating the errors introduced...