Browse Prior Art Database

Soldering Device

IP.com Disclosure Number: IPCOM000075519D
Original Publication Date: 1971-Oct-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Allen, LK: AUTHOR

Abstract

Solder reflow for wire attachment can be accomplished by holding the wire next to the solder and heating the wire between spaced electrodes to indirectly melt the solder.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Soldering Device

Solder reflow for wire attachment can be accomplished by holding the wire next to the solder and heating the wire between spaced electrodes to indirectly melt the solder.

Wire end 1 is gripped between spaced, spring-biased clamps 2 and 3 that hold the wire against solder fillet 4 between pin 6 and circuit land 5 on substrate
7. A selectively timed pulse of direct current is then applied to the clamps to produce resistance heating of the wire. Concurrently the clamps urge the wire toward fillet 4 which melts as the wire becomes heated, allowing the wire to sink into the fillet.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]