Browse Prior Art Database

Oblong Power Supply Pads for Integrated Circuits

IP.com Disclosure Number: IPCOM000075547D
Original Publication Date: 1971-Oct-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Baker, TH: AUTHOR [+3]

Abstract

In the distribution of power supplies to integrated circuits, the use of oblong pads in the integrated circuit chip to which the power supply is applied minimizes problems resulting from the high current which must pass through such pads.

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Oblong Power Supply Pads for Integrated Circuits

In the distribution of power supplies to integrated circuits, the use of oblong pads in the integrated circuit chip to which the power supply is applied minimizes problems resulting from the high current which must pass through such pads.

It has been found that where round pads are used for such high currents, the current density at the leading edge of these round pads becomes excessive. By leading edge, is meant the edge of the round pad in the direction of current flow. Such high-current density regions may cause some electromigration of the pad material, which could result in short-circuit or corrosion problems.

As shown in the figure, the oblong pads 11 and 12 used for the -V power supply applied to integrated circuit chip 10 avoid this problem, by bringing leading edges 13, 14 and 15 in the direction of current flow, respectively, to bus bars 16, 17 and 18, as indicated by the arrows. This expedient reduces the current flow at these leading edges.

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