Browse Prior Art Database

Integrally Grooved Semiconductor Chip and Heat Sink

IP.com Disclosure Number: IPCOM000075548D
Original Publication Date: 1971-Oct-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Johnson, AH: AUTHOR

Abstract

The cooling of integrated circuit chips is a major concern and limiting factor in semiconductor packaging. Techniques which minimize heating through solder joints and ceramics are limited by the thermal conductivity of the ceramic material, and the thermal restrictions of the solder joints. Solutions which add separate heat sinks to the semiconductor chips provide improved heat dissipation, but difficulty is encountered in obtaining good thermal bonds to the chip because of thermal mismatch, and some of the desired heat sink materials, such as molybdenum, are extremely expensive to machine.

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Integrally Grooved Semiconductor Chip and Heat Sink

The cooling of integrated circuit chips is a major concern and limiting factor in semiconductor packaging. Techniques which minimize heating through solder joints and ceramics are limited by the thermal conductivity of the ceramic material, and the thermal restrictions of the solder joints. Solutions which add separate heat sinks to the semiconductor chips provide improved heat dissipation, but difficulty is encountered in obtaining good thermal bonds to the chip because of thermal mismatch, and some of the desired heat sink materials, such as molybdenum, are extremely expensive to machine.

The present technique provides a semiconductor chip 10 having fins or grooves 12 formed therein as an integral part of the silicon chip. Such heat sinks are adaptable for both liquid and air cooling systems. After the semiconductor devices 14 are diffused into the wafer 10, the fins or grooves are formed in any desired shape prior to wafer dicing. Heat dissipating area increases of three to four times are realized, which significantly improves the heat transfer characteristics of the device.

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