Browse Prior Art Database

Area Array Probe Configuration

IP.com Disclosure Number: IPCOM000075635D
Original Publication Date: 1971-Oct-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Markewycz, Z: AUTHOR [+2]

Abstract

This probe fixture extends the contact capability for the probes to the internal pad locations of an integrated circuit chip. The probes contacting the periphery of the chip, as well as the internal pad locations have the same deflection and contact force.

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Area Array Probe Configuration

This probe fixture extends the contact capability for the probes to the internal pad locations of an integrated circuit chip. The probes contacting the periphery of the chip, as well as the internal pad locations have the same deflection and contact force.

Chip segment 1 has peripheral pad locations 2, 3 and randomly positioned internal pad locations 4, 5. The chip is also provided with a product pad location
6. Each of these groups of locations is a different distance from a common support line 7. Pad locations 2, 5 and 6 are contacted by probes 8, 9, 10. The probes are mounted to supporting structure including pivot blocks 11A-C, extendable arms 12A-C and fixed blocks 13A-C

To assure that the same contact force and probe deflection is achieved by each probe 8, 9, 10 when contacting its respective pad location 2, 5, 6, the fulcrum points for the probes are adjusted. The probe length from pivot blocks 11A-C to the pad locations is constant for all probes. However, the pivot blocks are moved with respect to common support line 7. Thus, probe 9 contacting internal pad location 5 has pivot block 11b moved inwardly toward chip 1. Probe 8 contacting pad location 2 at a periphery location has pivot block 11a adjusted to approach line 7, and probe 10 contacting location 6 at the edge of chip 1 is moved outwardly away from line 7.

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