Browse Prior Art Database

Wafer Adjusting Arrangement

IP.com Disclosure Number: IPCOM000075655D
Original Publication Date: 1971-Oct-01
Included in the Prior Art Database: 2005-Feb-24
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Bordt, H: AUTHOR

Abstract

For the contactless, plane-parallel adjustment of wafers 1 to mask 2, observing a predetermined spacing, adjusting plate 3, to whose lower edge wafer 1 is adjusted, is moved, in a first step, in between wafer 1 and mask 2, or the wafer is moved under a fixed adjusting plate in a multi station switchboard design. In a second step, plate 3 is moved out, and wafer 1 is raised by the thickness of plate 3 plus the measured spacing between plate 3 and wafer 1.

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Wafer Adjusting Arrangement

For the contactless, plane-parallel adjustment of wafers 1 to mask 2, observing a predetermined spacing, adjusting plate 3, to whose lower edge wafer 1 is adjusted, is moved, in a first step, in between wafer 1 and mask 2, or the wafer is moved under a fixed adjusting plate in a multi station switchboard design. In a second step, plate 3 is moved out, and wafer 1 is raised by the thickness of plate 3 plus the measured spacing between plate 3 and wafer 1.

Wafer 1 is fixed by vacuum nozzles 5 to socket-shaped wafer support 4. In the moved in state, plate 3, which has a thickness of "b" and is arranged above nozzles 5, is spaced about 20 mu from the lower face of mask 2. Support 4 with its guide element 6 is raised until there is a uniform spacing of a = 20 to 30 mu between wafer 1 and the lower face of plate 3 (Fig. A). Contact between plate 3 and wafer 1 is avoided by an air cushion provided by pressure nozzles 8 in plate
3.

For the vertical movement of support 4, its element 6 is air-cushioned in guide 7. Support 4, on its part, is arranged to be movable in element 6 by compressed-air being fad through channels 9, so that plate 3 aligns itself automatically, compensating for sloping, if any, in the thickness of wafer 1. Alternatively, Cardanic suspension can be used for the wafer support.

Subsequently, channels 9 are changed from compressed-air to vacuum, to cause support 4 carrying wafer 1 to be fixed in element 6. Then spacing "a" be...